ATFSI’s in-line sputter deposition equipment. This equipment is capable of both plasma treatment and sputter deposition from 5 linear sputter sources. It has the capability to also deposit 2 materials double-sided using opposing sputter sources. It is possible to use several modes of sputter deposition using this equipment: RF or DC excitation, and reactive or non-reactive processes. The equipment is capable of processing material in batch fashion on a platen with dimensions 14” x 14”.